Design and optimization of an ultra-compact thermal management system integrated with micro-fins for high power applications
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Abstract
High-power semiconductors require powerful and compact cooling systems in order to maintain operational capabilities. A key component that requires significant heat extraction (several hundreds of watts up to 1 kW) are silicon photo-conductive semiconductor switches (Si-PCSS). Many methods of thermal management have been studied, which include (in order from lowest to highest heat extraction performance) passive cooling (heat sinks, cooling fins), passive multi-phase cooling (heat pipes), active single-phase liquid cooling (microchannel cooling systems), or active single-phase turbulent cooling (jet impingement systems). To dissipate up to 1 kW of heat per unit area (heat flux of 1kW/cm2) to maintain the device temperature below 80 ◦C, a single-phase jet impingement cooling system was designed. The jet impingement thermal management system iii (JI-TMS) was studied computationally using computational fluid dynamics (CFD) modeling. The proposed JI-TMS consists of an array of nozzles, impinging fluid onto the heated target surface. The main contributing factor to poor performance of impinging jet thermal management systems is due to the pressure drop across the TMS. Further iterations of the design meet the stretch goal cooling requirement of greater than (2 kW/cm2), therefore fins will be implemented and a preliminary study for the combination of fins and impinging jets will take place to develop a UJI-TMS. The UJI-TMS will be simulated and validated experimentally.
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Macro-scale cooling methodologies for semiconductor devices -- Design and development of an ultra compact thermal management system for a semiconductor device with the implementation of dielectric fluids -- Performance enhancement of GaN PA integrated with UJI-TMS -- Future work: miniaturized TMS -- Publications and presentations
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M.S. (Master of Science)