A Study of Detecting Bond Wire Lift-offs and Surface Defect of High Power IGBT Modules Using Acoustics Waves
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This thesis explores the development of a noninvasive technique that utilizes low- cost piezoelectric resonators for the detection of bond wire lift-off in isolated gate bipolar junction transistor (IGBT) modules. To evaluate the proposed method, controlled damage induction on new IGBTs was initially considered. However, due to the high cost of high-power IGBT modules and the need for multiple sets of data, an alternative approach was devised. Bond wires within IGBT modules were replicated using a 3D printed enclosure, a PCB, and copper wires closely resembling real IGBTs. This allowed the construction of multiple test devices at a fraction of the cost of actual IGBT modules, facilitating the fine-tuning of the proposed technique without damaging expensive components. Consequently, our findings demonstrate the ability to determine IGBT degradation and bond wire lift-offs using only two sensors, a significant improvement over the recently reported setups that required six sensors. Additionally, optimal sensor locations were identified by conducting multiple placements within the IGBT casing. The manuscript also computationally investigated the identification of the optimum acoustic frequency for detecting bond-wire lift-off. While the previous solution exhibited a certain level of accuracy in detecting bond wire degradation, the resonator frequency was never optimized for maximum detection sensitivity. Therefore, an in-depth acoustic analysis of the detection system was undertaken to determine the resonators’ optimized frequency. The resonance frequency and eigenfrequency analysis were investigated using COMSOL Multiphysics, a Finite-Element based package. The utilization of these techniques offers a promising avenue for cost-effective and efficient condition monitoring of semiconductor devices. Furthermore, integrating these methods with the gate driver module can provide seamless compatibility and improved functionality. By employing low-cost piezoelectric resonators and optimizing the resonator frequency, the proposed approach contributes to the advancement of noninvasive bond wire lift-off detection in IGBT modules, reducing costs and enhancing the reliability of power electronic systems. Manuscript also delves into the optimization of resonator frequency for bond wire detachment detection. While the previous solution exhibited a certain level of accuracy in detecting bond wire degrada- tion, the resonator frequency was never optimized for maximum detection sensitivity. Therefore, an in-depth acoustic analysis of the detection system was undertaken to determine the resonators’ optimized frequency. The resonance frequency and eigenfrequency analysis were investigated using COMSOL Multiphysics, an advanced simulation tool, aiming for successful outcomes. The utilization of these techniques offers a promising avenue for cost-effective and efficient condi- tion monitoring of semiconductor devices. Furthermore, integrating these methods with the gate driver mod- ule can provide seamless compatibility and improved functionality. By employing low-cost piezoelectric resonators and optimizing the resonator frequency, the proposed approach contributes to the advancement of noninvasive bond wire lift-off detection in IGBT modules, reducing costs and enhancing the reliability of power electronic systems.
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Introduction -- A COMSOL multiphysics model of IGBT bond wire structure and resonator network to detect bond wire degradation while optimizing resonator frequency -- Conclusion
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M.S. (Master of Science)