Vapor-chamber-based modular cold plate for TO-247 power semiconductor CFD setup, desgin & verification
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TO-247 packaged power semiconductors offer a low-cost alternative to power modules for high-volume, high-power applications, but their highly localized heat fluxes create significant thermal management challenges. This work proposes a compact 13.5 × 18.95 mm² two-phase cold plate that integrates a vapor chamber (VC) with a liquid-cooled heat sink, designed specifically for fabrication via laser powder bed fusion (L-PBF). The additively manufactured design incorporates enclosed channel networks and micropillar structures to enhance coolant distribution and heat spreading. A key contribution of this study focuses on the use of computational fluid dynamics (CFD) simulations in ANSYS Icepak to evaluate the thermal performance of the proposed dual-phase architecture. The CFD analysis directly compares a single-phase baseline with the integrated VC–liquid-cooling configuration under a 400 W/cm² heat load. CFD results demonstrate that the proposed dual-phase architecture substantially reduces peak temperature and improves spatial temperature uniformity compared with a single-phase cold-plate baseline. Under identical operating conditions, the integrated VC–liquid-cooling design achieves approximately 25% lower maximum temperature, demonstrating the effectiveness of combining L-PBF design freedom with two-phase thermal management for TO-247 devices.
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M.S.