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dc.contributor.authorVincent, Christopher John, 1976-eng
dc.contributor.corporatenameUniversity of Missouri-Columbia. Office of Undergraduate Researcheng
dc.contributor.meetingnameUndergraduate Research and Creative Achievements Forum (2006 : University of Missouri--Columbia)eng
dc.date2006eng
dc.date.issued2006eng
dc.descriptionAbstract only availableeng
dc.description.abstractA CPU's calculation speed is limited by the heat it produces. As CPU's become more powerful, they also generate more heat which must be removed or the chip will burn up. CPUs in laptops and some desktop computers are currently cooled using heat pipe heat sinks. However, as CPU's increase in power, greater heat transfer capacity will be required, and the capabilities of current heat pipe designs will be exceeded. A nano-fluid pulsating heat pipe has a much greater heat transport capacity and may be the solution. Thus far, large-scale nano-fluid pulsating heat pipes have been developed; however, if this technology is to prove useful in cooling laptops and other electrical equipment, the size must be greatly reduced. Thus, the purpose of this research project is to design, analyze, and optimizes a micro-sized heat pipe. A prototype will then be built and tested for further improvements.eng
dc.description.sponsorshipCollege of Engineering Honors Undergraduate Research Optioneng
dc.identifier.urihttp://hdl.handle.net/10355/1529eng
dc.languageEnglisheng
dc.publisherUniversity of Missouri - Columbia Office of Undergraduate Researcheng
dc.relation.ispartofcommunityUniversity of Missouri-Columbia. Office of Undergraduate Research. Undergraduate Research and Creative Achievements Forumeng
dc.source.urihttp://undergradresearch.missouri.edu/forums-conferences/abstracts/abstract-detail.php?abstractid=eng
dc.subjectcentral processing unit (CPU)eng
dc.subjectheat transfer capacityeng
dc.subjectheat sinkseng
dc.titleDesign of a miniaturized nano-fluid pulsating heat pipe [abstract]eng
dc.typePresentationeng


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