Comparing impingement boiling vs. pool boiling to improve technological insight into liquid cooling in electronics [abstract]

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Comparing impingement boiling vs. pool boiling to improve technological insight into liquid cooling in electronics [abstract]

Please use this identifier to cite or link to this item: http://hdl.handle.net/10355/1840

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dc.contributor.author Witte, Matt en
dc.contributor.author Bryan, James E., 1964- en
dc.contributor.author Feng, Xin, 1978- en
dc.contributor.author Jackson, Jenny E. en
dc.date 2007 en
dc.date.accessioned 2009-06-25T14:23:50Z en
dc.date.available 2009-06-25T14:23:50Z en
dc.date.issued 2007 en
dc.identifier.uri http://hdl.handle.net/10355/1840
dc.description Abstract only available en
dc.description.abstract With the field of technology advancing at a rapid pace so must the technology behind cooling these electronic parts. My research compares two completely different of cooling operations and compares many different fluids in each method. This research will help lead the electronics industry into the future of liquid cooling. The first method is impingement boiling where jets of fluid spray a heated copper coupon and as the fluid rapidly boils it removes large amounts of heat. Jet arrays will be tested for one jet, four jets, and nine jets. Also we will experiment with different sorts of surface finishes on the heated copper coupon to see how this affects heat transfer. The three fluids that will be tested in this experiment are Water, Ethanol, and HFE7000. With these fluid's contrasting properties we should obtain great insight into what properties are most desired for this form of cooling. The second method of removing heat will be by pool boiling. For these tests will have a similar copper coupon, but in this case the fluid is allowed to gather in a pool completely submersing the copper coupon. We will be testing the fluids listed above plus some additional nanofluids. This is a very simple form of boiling that yields great amounts of heat transfer. Pool boiling as well as impingement boiling both have a very positive outlook for the future of liquid cooling and I hope to offer more insight though my research. en
dc.language en_US en
dc.language.iso en_US en
dc.publisher University of Missouri--Columbia. Office of Undergraduate Research en
dc.relation.ispartof 2007 Undergraduate Research and Creative Achievements Forum (MU) en
dc.source.uri http://undergradresearch.missouri.edu/forums-conferences/abstracts/abstract-detail.php?abstractid= en
dc.subject cooling operations en
dc.subject electronics industry en
dc.subject copper coupon en
dc.title Comparing impingement boiling vs. pool boiling to improve technological insight into liquid cooling in electronics [abstract] en
dc.type Presentation en
dc.contributor.meetingname Undergraduate Research and Creative Achievements Forum (2007 : University of Missouri--Columbia) en
dc.contributor.corporatename University of Missouri-Columbia. Office of Undergraduate Research en
dc.relation.ispartofcommunity University of Missouri-Columbia. Office of Undergraduate Research. Undergraduate Research and Creative Achievements Forum


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