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dc.contributor.advisorFeng, Zaichunen
dc.contributor.authorPaspuleti, Sumaen_US
dc.date.issued2005eng
dc.date.submitted2005 Summeren
dc.descriptionThe entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file.en_US
dc.descriptionTitle from title screen of research.pdf file viewed on (July 14, 2006)en_US
dc.descriptionIncludes bibliographical references.en_US
dc.descriptionThesis (M.S.) University of Missouri-Columbia 2005.en_US
dc.descriptionDissertations, Academic -- University of Missouri--Columbia -- Mechanical and aerospace engineering.en_US
dc.description.abstractDevices with feature size on the order of one micrometer have found widespread applications in science and engineering. MEMS, is a rapidly growing technology for the fabrication of miniature devices which provides a way to integrate mechanical, fluidic, optical, and electronic functionality on very small devices, ranging from 0.1 microns to one millimeter. Recently, it has been proposed that regular patterns can be generated through the mechanical buckling of a thin film. In this thesis, we focus on the buckling mechanism. The wavy patterns are generated when the thin elastic film is subjected to an in-plane compressive stress and by the application of controlled heating. We first introduce the mechanism of developing wave patterns through buckling using beam buckling as an example and then the finite element formulation and the commercial analysis package Algor. Our study includes the "stress stiffening" component, which is not usually included in most finite element analyses. Both the "Critical Buckling Load" and the "Natural Frequency with Load Stiffening" analyses are made use of to determine the buckling loads. Finally, the buckling load for each case is determined through the analysis and a comparison with the theoretical values is made.en_US
dc.identifier.merlin.b55880423en_US
dc.identifier.otherPaspuletiS-072005-T2612en_US
dc.identifier.urihttp://hdl.handle.net/10355/4302
dc.publisherUniversity of Missouri--Columbiaen_US
dc.relation.ispartof2005 Freely available theses (MU)en_US
dc.relation.ispartofcommunityUniversity of Missouri-Columbia. Graduate School. Theses and Dissertations. Theses. 2005 Theses
dc.subject.lcshMicroelectromechanical systemsen_US
dc.subject.lcshBuckling (Mechanics)en_US
dc.subject.lcshThin filmsen_US
dc.titleMechanical and thermal buckling of thin filmsen_US
dc.typeThesisen_US
thesis.degree.disciplineMechanical and aerospace engineeringen_US
thesis.degree.disciplineMechanical and aerospace engineeringeng
thesis.degree.grantorUniversity of Missouri--Columbiaen_US
thesis.degree.levelMastersen_US
thesis.degree.nameM.S.en_US


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