Mechanical and thermal buckling of thin films

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Mechanical and thermal buckling of thin films

Please use this identifier to cite or link to this item: http://hdl.handle.net/10355/4302

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dc.contributor.advisor Feng, Zaichun en
dc.contributor.author Paspuleti, Suma en_US
dc.date.accessioned 2010-01-12T16:46:45Z
dc.date.available 2010-01-12T16:46:45Z
dc.date.issued 2005 en_US
dc.date.submitted 2005 Summer en
dc.identifier.other PaspuletiS-072005-T2612 en_US
dc.identifier.uri http://hdl.handle.net/10355/4302
dc.description The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. en_US
dc.description Title from title screen of research.pdf file viewed on (July 14, 2006) en_US
dc.description Includes bibliographical references. en_US
dc.description Thesis (M.S.) University of Missouri-Columbia 2005. en_US
dc.description Dissertations, Academic -- University of Missouri--Columbia -- Mechanical and aerospace engineering. en_US
dc.description.abstract Devices with feature size on the order of one micrometer have found widespread applications in science and engineering. MEMS, is a rapidly growing technology for the fabrication of miniature devices which provides a way to integrate mechanical, fluidic, optical, and electronic functionality on very small devices, ranging from 0.1 microns to one millimeter. Recently, it has been proposed that regular patterns can be generated through the mechanical buckling of a thin film. In this thesis, we focus on the buckling mechanism. The wavy patterns are generated when the thin elastic film is subjected to an in-plane compressive stress and by the application of controlled heating. We first introduce the mechanism of developing wave patterns through buckling using beam buckling as an example and then the finite element formulation and the commercial analysis package Algor. Our study includes the "stress stiffening" component, which is not usually included in most finite element analyses. Both the "Critical Buckling Load" and the "Natural Frequency with Load Stiffening" analyses are made use of to determine the buckling loads. Finally, the buckling load for each case is determined through the analysis and a comparison with the theoretical values is made. en_US
dc.language.iso en_US en_US
dc.publisher University of Missouri--Columbia en_US
dc.relation.ispartof 2005 Freely available theses (MU) en_US
dc.subject.lcsh Microelectromechanical systems en_US
dc.subject.lcsh Buckling (Mechanics) en_US
dc.subject.lcsh Thin films en_US
dc.title Mechanical and thermal buckling of thin films en_US
dc.type Thesis en_US
thesis.degree.discipline Mechanical and aerospace engineering en_US
thesis.degree.grantor University of Missouri--Columbia en_US
thesis.degree.name M.S. en_US
thesis.degree.level Masters en_US
dc.identifier.merlin .b55880423 en_US
dc.relation.ispartofcommunity University of Missouri-Columbia. Graduate School. Theses and Dissertations. Theses. 2005 Theses


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