Improving bonding strength of mild self-etching adhesive to ground and intact enamel by plasma treatment
Metadata[+] Show full item record
[ACCESS RESTRICTED TO THE UNIVERSITY OF MISSOURI AT AUTHOR'S REQUEST.] Enamel/adhesive bonding strength plays an important role in dental restoration and orthodontic bonding. Improving enamel/adhesive bonding is a widely investigated topic in dentistry. Non-thermal plasma technique is a powerful method to improve the surface properties without changing bulk property. Highly reactive particles from plasma react with, clean, or etch material surfaces, consequently altering the surface characteristics. After plasma treatment, enamel/adhesive bonding strength increased significantly (p<0.01) after micro-tensile bonding strength test; the water contact angle and adhesive contact angle on enamel surface decreased a lot (p<0.05). Weibull analysis revealed that Weibull modulus for plasma-treated specimens was increased. SEM examination of the fracutred surface and enamel-adhesive interface revealed that plasma treatment improve interface quality, which could be attributed to the increase of surface energy and reduce of adhesive contact angle on enamel surface following plasma treatment. This study opens a door to use non-thermal plasma treatment technique in dentistry of caries restoration.
Access to files is limited to the University of Missouri--Columbia.