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dc.contributor.advisorWinholtz, Robert Andrew, 1961-eng
dc.contributor.authorStover, Stefaneng
dc.date.issued2018eng
dc.date.submitted2018 Falleng
dc.description.abstractAs electronic devices increase in performance and decrease in size, more efficient thermal management systems are necessary to combat high heat fluxes. Copper heat pipes, and oscillating heat pipes are devices commonly used in the electronics industry to remove high heat fluxes, safeguarding sensitive electronic components from thermal damage. The surface application of cupric oxide nanostructures to the interior heat pipe channel leads to a reduction of temperatures in the evaporator region of the oscillating heat pipe assembly by as much as 59.1%. The application of cupric oxide nanostructures to the oscillating heat pipe surfaces provides a simple and effective way to further reduce temperature differences between the evaporator and condenser regions of a copper oscillating heat pipe.eng
dc.description.bibrefIncludes bibliographical references.eng
dc.format.extentix, 33 pages : illustrationeng
dc.identifier.urihttps://hdl.handle.net/10355/67645
dc.languageEnglisheng
dc.publisherUniversity of Missouri--Columbiaeng
dc.relation.ispartofcommunityUniversity of Missouri--Columbia. Graduate School. Theses and Dissertationseng
dc.rightsOpenAccess.eng
dc.rights.licenseThis work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivs 3.0 License.
dc.titleThermal performance of a Nam-Ju nanostructured copper oscillating heat pipeeng
dc.typeThesiseng
thesis.degree.disciplineMechanical and aerospace engineering (MU)eng
thesis.degree.grantorUniversity of Missouri--Columbiaeng
thesis.degree.levelMasterseng
thesis.degree.nameM.S.eng


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