Electric field and temperature-induced removal of moisture in nanoporous organosilicate films

Electric field and temperature-induced removal of moisture in nanoporous organosilicate films

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Electric field and temperature-induced removal of moisture in nanoporous organosilicate films

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dc.contributor.author	Biswas, N.
dc.contributor.author	Lubguban, J. A.
dc.contributor.author	Gangopadhyay, Shubhra
dc.date.accessioned	2010-08-12T15:46:11Z
dc.date.available	2010-08-12T15:46:11Z
dc.date.issued	2004-05-07
dc.identifier.citation	Appl. Phys. Lett. 84, 4254 (2004)	en
dc.identifier.issn	0003-6951
dc.identifier.uri	http://hdl.handle.net/10355/8205
dc.description	doi:10.1063/1.1757019	en
dc.description.abstract	The effects of bias-temperature-stress (BTS) or simply temperature-stress (TS) on nanoporous low-k methylsilsesquioxane films are studied. Initially, the as-given and O2 ashed/etched films exhibit physical adsorption of moisture as revealed from the electrical behavior of the samples after 15 days. The temperature stressing at 170 °C volatilized the adsorbed water but is unable to remove chemisorb and hydrophillic Si-OH groups. As a result, the TS films remain susceptible to moisture. BTS at 170 °C also removes adsorbed water. More important, the surfaces under the metal-insulator structure were dehydroxylated by breaking the chemisorb Si-OH group facilitating the formation of siloxane bonds that prevents adsorption of moisture even after 60 days.	en
dc.description.sponsorship	The authors would like to acknowledge Dorel Toma of TEL for providing the samples, and SRC and NSF for funding this research.	en
dc.language.iso	en_US	en
dc.publisher	American Institute of Physics	en
dc.relation.ispartof	Electrical and Computer Engineering publications	en
dc.subject	nanoscale materials	en
dc.subject	adsorption kinetics	en
dc.subject	nanoporous materials	en
dc.subject	high-temperature effects	en
dc.subject.lcsh	Thin films	en_US
dc.subject.lcsh	Porous materials	en_US
dc.title	Electric field and temperature-induced removal of moisture in nanoporous organosilicate films	en
dc.type	Article	en
dc.relation.ispartofcommunity	University of Missouri-Columbia. College of Engineering. Department of Electrical and Computer Engineering

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