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dc.contributor.authorMa, Hongbin, 1962-eng
dc.contributor.authorCheng, Peng, 1979-eng
dc.contributor.authorBoswell, Joeeng
dc.contributor.meetingnameMissouri Technology Expoeng
dc.date.issued2010-10eng
dc.description.abstractThe current active thermal electric cooling system being used for electronic components or systems has a low coefficient of performance (COP) which directly limits the application. The invention is a hybrid of both thermal electric and ejector refrigeration systems which can significantly increase the COP of the active cooling system. And it has no moving parts and the effect of the temperature difference across the thermal electric cooling module on the system COP can be significantly reduced. Potential Areas of Applications: * Electronic cooling * Computer chip thermal management * Laser coolingeng
dc.format.extent1 pageeng
dc.identifier.urihttp://hdl.handle.net/10355/9733eng
dc.relation.ispartofAbstracts (Missouri Technology Expo 2010)eng
dc.relation.ispartofcommunityUniversity of Missouri-Columbia. Missouri Technology Expo. Missouri Technology Expo 2010eng
dc.subjectenergy efficiencyeng
dc.subjectrefrigerationeng
dc.titleHybrid integrated thermal electric and ejector active cooling system [abstract]eng
dc.typeAbstracteng


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