SiCON nanocomposite dielectric thin film [abstract]

Abstract

SiCON is a nanocomposite thin film consisting of silicon dioxide, silicon carbide, and carbon nitride nanostructures deposited by plasma-enhanced chemical vapor deposition. SiCON harnesses the beneficial characteristics of silicon dioxide and silicon carbide by employing nanotechnology and materials science to combine these characteristics into a coating that is transparent, high strength, scratch resistant, crack free, and has favorable optical and electrical properties. The coating can be performed at various deposition temperatures from near-ambient to 400°C without sacrificing the beneficial properties. This characteristic provides the ability to coat on many materials including glass, metals, and plastics. Electrical measurements indicate SiCON has excellent insulating properties and a high breakdown strength greater than 5MV/cm. The coating can also be used in extreme environments, such as high temperature and radioactive environments, without significantly altering the properties of SiCON. Potential Areas of Applications: * High energy density capacitors * Insulating layer for surgical tools, etc. * Chemical- and etch-resistant coating * Anti-reflection and anti-scratch coating for screens and lenses * Coating used in extreme environments like high temperatures or radioactive environments

Patent Status: Provisional or Non provisional patent application on file Inventor(s): Shubhra Gangopadhyay, Keshab Gangopadhyay, Maruf Hossain Contact Info: Dr. Wayne McDaniel, Ph.D. ; McDanielWC@missouri.edu ; 573-884-3302