Electric field and temperature-induced removal of moisture in nanoporous organosilicate films
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The effects of bias-temperature-stress (BTS) or simply temperature-stress (TS) on nanoporous low-k methylsilsesquioxane films are studied. Initially, the as-given and O2 ashed/etched films exhibit physical adsorption of moisture as revealed from the electrical behavior of the samples after 15 days. The temperature stressing at 170 °C volatilized the adsorbed water but is unable to remove chemisorb and hydrophillic Si-OH groups. As a result, the TS films remain susceptible to moisture. BTS at 170 °C also removes adsorbed water. More important, the surfaces under the metal-insulator structure were dehydroxylated by breaking the chemisorb Si-OH group facilitating the formation of siloxane bonds that prevents adsorption of moisture even after 60 days.
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