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dc.contributor.advisorPinhero, Patrick Josepheng
dc.contributor.authorFreiling, Tristaneng
dc.date.issued2012eng
dc.date.submitted2012 Springeng
dc.descriptionTitle from PDF of title page (University of Missouri--Columbia, viewed on September 19, 2012).eng
dc.descriptionThe entire thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file; a non-technical public abstract appears in the public.pdf file.eng
dc.descriptionThesis advisor: Dr. Patrick Pinheroeng
dc.descriptionIncludes bibliographical references.eng
dc.descriptionM. S. University of Missouri--Columbia 2012.eng
dc.descriptionDissertations, Academic -- University of Missouri--Columbia -- Chemical engineering.eng
dc.description"May 2012"eng
dc.description.abstract[ACCESS RESTRICTED TO THE UNIVERSITY OF MISSOURI AT AUTHOR'S REQUEST.] Embrittlement of polycrystalline Cu by a liquid metal embitter species, such as Bi, is a well-documented phenomenon that is still relatively poorly understood. It has been shown previously that copper suffers from a reduction in ductility at intermediate temperatures with respect to its melting point and an increase at high temperatures below its melting point. This ductility trough is commonly referred to as intermediate temperature embrittlement (ITE). Further reduction in ductility is observed in the presence of a known embrittler by mechanisms such as grain boundary embrittlement (GBE), solid metal embrittlement (SME), and liquid metal embrittlement (LME). All of these effects act synergistically along with an applied load to cause intergranular fracture and ultimately material failure. Finite element analysis (FEA) was used to begin development of an empirical model to accurately predict failure of Cu as a function of temperature, exposure time, Bi concentration, and applied load. The grain structure of Cu was modeled using a modified 2D Voronoi diagram from experimental Cu micrographs obtained using a scanning electron microscope (SEM). Experimental load-displacement curves of Cu with Bi deposited on the surface at various temperatures were used to calibrate a traction-separation to predict the embrittlement behavior of the copper-bismuth system.eng
dc.format.extentix, 92 pageseng
dc.identifier.urihttp://hdl.handle.net/10355/15400
dc.languageEnglisheng
dc.publisherUniversity of Missouri--Columbiaeng
dc.relation.ispartofcollectionUniversity of Missouri--Columbia. Graduate School. Theses and Dissertationseng
dc.rightsAccess to files is limited to the University of Missouri--Columbia.eng
dc.subjectelectrochemistryeng
dc.subjectintermediate temperature embrittlementeng
dc.subjectductilityeng
dc.subjectVoronoi diagrameng
dc.titleBismuth induced embrittlement of a copper substrateeng
dc.typeThesiseng
thesis.degree.disciplineChemical engineering (MU)eng
thesis.degree.grantorUniversity of Missouri--Columbiaeng
thesis.degree.levelMasterseng
thesis.degree.nameM.S.eng


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